1.

Conference Proceedings
Conference Proceedings
1. Wafer Bonding of Compound Semiconductors using Atomic Hydrogen
Akatsu, T. ; Ploessl, A. ; Stenzel, H. ; Goesele, U.
Pub. info.: Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia.  pp.60-67,  1999.  Pennington, N.J..  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 99-35
2.

Conference Proceedings
Conference Proceedings
2. Room Temperature Covalent Bonding: Effect on Interfacial Properties
Ploessl, A ; Scholz, R. ; Akatsu, T.
Pub. info.: Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia.  pp.232-243,  1999.  Pennington, N.J..  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 99-35