1.

Conference Proceedings
Conference Proceedings
1. Challenges of damascene etching for copper interconnect
Ho,P.K.K. ; Zhou,M.-S. ; Gupta,S. ; Chockalingam,R. ; Li,J.-X. ; Fan,M.-H.
Pub. info.: Multilevel Interconnect Technology III.  pp.34-41,  1999.  Bellingham, Wash..  SPIE - The International Society for Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 3883
2.

Conference Proceedings
Conference Proceedings
2. Post-etching polymer removal in sub-half-micron device technology
Chooi,S.Y.M. ; Ismail,Z. ; Ee,P.-Y. ; Zhou,M.-S.
Pub. info.: Multilevel Interconnect Technology II.  pp.181-190,  1998.  Bellingham, Wash..  SPIE-The International Society for Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 3508