1.

Conference Proceedings
Conference Proceedings
1. Integrity of Copper-Tantalum Nitride Metallization Under Different Ambient Conditions
Yap, K.P. ; Gong, H. ; Dai, J.Y. ; Osipowicz, T. ; Chan, L.H. ; Lahiri, S.K.
Pub. info.: Low and High Dielectric Constant Materials : Materials Science, Processing, and Reliability Issues, proceedings of the fourth International Symposium and Thin Film Materials for Advanced Packaging Technologies : proceedings of the second International Symposium.  pp.195-208,  1999.  Pennington, N.J..  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 99-7
2.

Conference Proceedings
Conference Proceedings
2. Low Cost Underbump Metallisation for Flip-Chip Packages
Yap, K.P. ; Cui, C.Q. ; Lahiri, S.K.
Pub. info.: Dielectric material integration for microelectronics.  pp.313-325,  1998.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 98-3