1.

Conference Proceedings
Conference Proceedings
1. Overlay improvement on 0.15-μm production with ASML IOSc (improved overlay scanner) package
Liu,K.-Y. ; Wang,S.S. ; Chu,Y.Y. ; Hsieh,J.C.
Pub. info.: Lithography for semiconductor manufacturing II : 30 May-1 June, 2001, Edinburgh, UK.  pp.45-55,  2001.  Bellingham, Wash..  SPIE-The International Society for Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 4404
2.

Conference Proceedings
Conference Proceedings
2. Controlled thickness and dielectric constant titanium-doped SiO2 thin films on silicon by sol gel process
Liu,H.L. ; Wang,S.S. ; Zhou,Y. ; Lam,Y.L. ; Chan,Y.C. ; Kam,C.H.
Pub. info.: Microelectronic Packaging and Laser Processing.  pp.47-56,  1997.  Bellingham, Wash..  SPIE-The International Society for Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 3184