1.

Conference Proceedings
Conference Proceedings
1. Dopants in Electroplated Copper
Andricacos, P.C. ; Parks, C. ; Cabral, C. ; Wachnik, R. ; Tsai, R. ; Maihotra, S. ; Locke, P. ; Fluegel, J. ; Horkans, J. ; Kwietniak, K. ; Uzoh, C. ; Rodbell, K.P. ; Gignac, L. ; Walton, E. ; Chung, D. ; Geffren, R.
Pub. info.: Electrochemical processing in ULSI fabrication and semiconductor/metal deposition II : proceedings of the international symposium.  pp.111-121,  1999.  Pennington, N.J..  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 99-9
2.

Conference Proceedings
Conference Proceedings
2. 30. Electroless Deposition of Thin Alloys Layers for Metal Passivation and Solder Barriers
Sambucetti, C.J. ; O'Sullivan, E. ; Paunovic, M. ; Uzoh, C. ; Marino, J.
Pub. info.: Proceedings of the Symposium on Fundamental Aspects of Electrochemical Deposition and Dissolution Including Modeling.  pp.336-345,  1997.  Pennington, New Jersey.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 97-27
3.

Conference Proceedings
Conference Proceedings
3. Damascene Electroplating for Copper Interconnections
Andriacacos, P.C. ; Uzoh, C. ; Dukovic, J.O. ; Horkans, J. ; Deligianni, H.
Pub. info.: Proceedings of the Symposia on Electrochemical Processing in ULSI Fabrication I and Interconnect and Contact Metallization: materials, processes, and reliability.  pp.48-58,  1998.  Pennington, N.J..  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 98-6
4.

Conference Proceedings
Conference Proceedings
4. Extendibility of Cu Damascene to 0.1 ｦﾌm Wide Interconnections
Hu, C-K. ; Lee, K. Y. ; Gignac, L. ; Rossnagel, S. M. ; Uzoh, C. ; Chan, K. ; Roper, P. ; Harper, J. M. E.
Pub. info.: Advanced interconnects and contact materials and processes for future integrated circuits : symposium held April 13-16, 1998, San Francisco, California, U.S.A..  pp.287-,  1998.  Warrendale, Pa..  MRS - Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 514