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16 results

Conference Proceedings

1. Call for an industry standard for pattern transfer models for usage in OPC and design for manufacturability [6156-07]

Roessler, T. ; Grimm, W. ; Thiele, J.

Pub. info.:	Design and process integration for microelectronic manufacturing IV : 23-24 February, 2006, San Jose, California, USA. pp.615607-, 2006. Bellingham, Wash.. SPIE - The International Society of Optical Engineering
Title of ser.:	Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:	6156

Conference Proceedings

2. Annotated layout optimization [6156-05]

Thiele, J. ; Kahle, R.

Pub. info.:	Design and process integration for microelectronic manufacturing IV : 23-24 February, 2006, San Jose, California, USA. pp.615605-, 2006. Bellingham, Wash.. SPIE - The International Society of Optical Engineering
Title of ser.:	Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:	6156

Conference Proceedings

3. Geometrical analysis of product layout as a powerful tool for DFM(Invited Paper)

Roessler, T. ; Thiele, J.

Pub. info.:	Design and process integration for microelectronic manufacturing III : 3-4 March 2005, San Jose, California, USA. pp.150-160, 2005. Bellingham, Wash.. SPIE - The International Society of Optical Engineering
Title of ser.:	Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:	5756

Conference Proceedings

4. Strategies of optical proximity correction dedicated to chromeless phase lithography for 65 and 45 nm node

Winkler, T. ; Dettmann, W. ; Hennig, M. ; Koestler, W. ; Moukara, M. ; Thiele, J. ; Zeiler, K.

Pub. info.:	Optical microlithography XVIII : 1-4 March, 2005, San Jose, California, USA. pp.476-487, 2005. Bellingham, Wash.. SPIE - The International Society of Optical Engineering
Title of ser.:	Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:	5754

Conference Proceedings

5. Complementary dipole exposure solutions at 0.29 k1

Heumann, J. ; Schramm, J. ; Birnstein, A. ; Park, K. T. ; Witte, T. ; Morgana, N. ; Hennig, M. ; Pforr, R. ; Thiele, J. ; Schmidt, N. ; Aquino, C.

Pub. info.:	Optical microlithography XVIII : 1-4 March, 2005, San Jose, California, USA. pp.327-338, 2005. Bellingham, Wash.. SPIE - The International Society of Optical Engineering
Title of ser.:	Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:	5754

Conference Proceedings

6. Vitamin E and the metabolic antioxidant network

Packer, L. ; Podda, M. ; Kitazawa, M. ; Thiele, J. ; Saliou, C. ; Witt, E. ; Traber, M. G.

Pub. info.:	Molecular mechanisms of signalling and membrane transport. pp.281-304, 1997. Berlin. Springer-Verlag
Title of ser.:	NATO ASI series. Series H, Cell biology
Ser. no.:	101

Conference Proceedings

7. Improved manufacturability by OPC based on defocus data

Thiele, J. ; Anke, I. ; Haffner, H. ; Semmler, A.

Pub. info.:	Design and process integration for microelectronic manufacturing II : 26-28 February 2003, Santa Clara, California, USA. pp.135-143, 2003. Bellingham, Wash.. SPIE-The International Society for Optical Engineering
Title of ser.:	Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:	5042

Technical Paper

8. Cylinder Heads for High Power Gasoline Engines-Thermomechanical Fatigue Life Prediction.

Thalmair, S. ; Thiele, J. ; Fischersworring-Bunk, A. ; Ehart, R. ; Guillou, M.

Pub. info.:	2006 SAE world congress : technical paper. 2006. Warrendale, Penn.. Society of Automotive Engineers
Title of ser.:	Society of Automotive Engineers technical paper series
Ser. no.:	2006

Conference Proceedings

9. Contact layer printing using alternating phase-shifting masks: mask making, patterning results, and production implementation

Pforr, R. ; Dettmann, W. ; Eisenhut, M. ; Hennig, M. ; Hofmann, D. ; Thiele, J. ; Thielscher, G.

Pub. info.:	20th European Conference on Mask Technology for Integrated Circuits and Microcomponents. pp.178-187, 2004. Bellingham, Wash.. SPIE - The International Society of Optical Engineering
Title of ser.:	Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:	5504

10.

Conference Proceedings

10. Simulation based OPC for contact pattern using 193 nm lithography [5853-63]

Keck, M. ; Bodendorf, C. ; Thiele, J. ; Gomez, A. L. ; Tseng, Y.-C. ; Huang, T.-Y.

Pub. info.:	Photomask and Next-Generation Lithography Mask Technology XII. pp.776-784, 2005. Bellingham, Wash.. SPIE - The International Society of Optical Engineering
Title of ser.:	Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:	5853

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Author: Thiele, J.