1.

Conference Proceedings
Conference Proceedings
1. Ultra-thin Tungsten CVD Nucleation Layer for Sub-100 nm Contact Applications
Gupta, J. ; Sudijono, J. ; Hsia, L.C. ; Singh, S.
Pub. info.: Copper Interconnects, New Contact Metallurgies/Structures, and Low-K Interlevel Dielectrics : proceedings of the International Symposium.  pp.16-20,  2003.  Pennington, N.J..  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2003-10
2.

Conference Proceedings
Conference Proceedings
2. THE DYNAMICAL TRANSITION TO STEP-FLOW GROWTH DURING HOMOEPITAXY OF GaAs (001)
Orr, B. G. ; Sudijono, J. ; Johnson, M. D.
Pub. info.: Common themes and mechanisms of epitaxial growth : symposium held April 13-15, 1993, San Francisco, California, U.S.A..  pp.15-,  1993.  Pittsburgh, Pa..  MRS - Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 312
3.

Conference Proceedings
Conference Proceedings
3. An Optimized PECVD SiN Deposition for Borderless Contact Etch-Stop-Layer (ESL) of Sub-0.25 um Logic Devices
Liu, H. ; Sudijono, J. ; Liin, C.W. ; Leong, W Y. ; Lam, K H.
Pub. info.: Copper Interconnects, New Contact Metallurgies/Structures, and Low-K Interlevel Dielectrics : proceedings of the International Symposium.  pp.160-164,  2000.  Pennington, N.J..  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2000-27