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28 results

Conference Proceedings

1. A thin 3D-2D convertible integral imaging system with a pinhole array on a polarizer

H. Choi ; Y. Kim ; S. Cho ; J. Kim ; B. Lee

Pub. info.:	Three-dimensional TV, video, and display V : 3-4 October, 2006, Boston, Massachusetts, USA. 2006. Bellingham, Wash.. SPIE - The International Society of Optical Engineering
Title of ser.:	Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:	6392

Conference Proceedings

2. In Situ Mass Spectrometry for Chemical Identification in SiC Epitaxial Deposition

B.H. Ponczak ; J.D. Oliver ; S. Cho ; G.W. Rubloff

Pub. info.:	Silicon carbide and related materials 2006 : ECSCRM 2006, Proceedings of the 6th European Conference on Silicon Carbide and Related Materials, Newcastle upon Tyne, UK, September 2006. pp.121-124, 2007. Stafa-Zuerich. Trans Tech Publications
Title of ser.:	Materials science forum
Ser. no.:	556-557

Conference Proceedings

3. Structural and Morphological Properties of Nitrogen Doped Polysilicon for Advanced Gate Material

S. Woo ; Y. Kim ; P. Um ; H. Kim ; S. Cho

Pub. info.:	Physics and technology of high-k gate dielectrics 5. pp.601-606, 2007. Pennington, NJ. Electrochemical Society
Title of ser.:	ECS transactions
Ser. no.:	11(4)

Conference Proceedings

4. Fatigue Striations and Fissures in 2024-T3 Aluminum Alloy

A.J. McEvily ; M. Endo ; S. Cho ; J. Kasivitamnuay ; H. Matsunaga

Pub. info.:	Materials structure & micromechanics of fracture V : selected, peer reviewed papers from 5th international conference on Materials Structure & Micromechanics of Fracture (MSMF-5), Brno, Czech Republic, June 27-29, 2007. pp.397-400, 2008. Aedermannsdorf, Switzerland. Trans Tech Publications
Title of ser.:	Materials science forum
Ser. no.:	567-568

Conference Proceedings

5. In-Situ Formation of Ag Capping Layer in Copper Chemical Mechanical Polishing

M. Kang ; S. Cho ; J. Kim

Pub. info.:	Thin Film Materials, Processes, and Reliability. pp.29-33, 2007. Pennington, N.J.. Electrochemical Society
Title of ser.:	ECS transactions
Ser. no.:	6(12)

Conference Proceedings

6. Acceleration Effect of CuCN in Ag Electrodeposition for Metal Interconnection

S. Cho ; J. Lee ; S. Kim ; J. Kim

Pub. info.:	ULSI process integration 5. pp.297-304, 2007. Pennington, N.J.. Electrochemical Society
Title of ser.:	ECS transactions
Ser. no.:	11(6)

Conference Proceedings

7. Numerical Study on Preliminary Thermal Mixing Test in B&C Loop Facility

H. S. Kang ; Y. S. Kim ; C. K. Park ; S. Cho ; C. H. Song

Pub. info.:	Symposia : Proceedings of the 4th ASME/JSME Joint Fluids Engineering Conference : presented at the 4th ASME/JSME Joint Fluids Engineering Conference : July 6-10, 2003, Honolulu, Hawaii. 2C pp.2107-2116, 2003. New York, N.Y.. American Society of Mechanical Engineers
Title of ser.:	ASME Symposia Volumes
Ser. no.:	FLUIDS 2003(2C)

Conference Proceedings

8. Selective Electroless Deposition Using Photoinduced Oxidation of Sn(II) Compounds on Surface-Modified Polyimide Layers

J. Kim ; T.V. Byk ; S. Cho ; C. Noh ; K. Song

Pub. info.:	Electrochemical Deposition on Non-Metallic Surfaces, Patterned Substrates, and Templates. pp.133-140, 2007. Pennington, N.J.. Electrochemical Society
Title of ser.:	ECS transactions
Ser. no.:	3(21)

Conference Proceedings

9. Change in the Film Properties According to the Various Electroplating Conditions

M. Kim ; S. Cho ; J. Kim

Pub. info.:	Electronics Packaging 3. pp.87-92, 2009. Pennington, NJ. Electrochemical Society
Title of ser.:	ECS transactions
Ser. no.:	16(22)

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Conference Proceedings

10. The Study of Workfunction Measurement Method for Bilayer Metal Gate Electrode using XPS

E. Jung ; C. Yim ; I. Yang ; H. Chang ; S. Cho

Pub. info.:	Advanced gate stack, source/drain and channel engineering for Si-based CMOS 4 : new materials, processes and equipment. pp.187-191, 2008. Pennington, N.J.. Electrochemical Society
Title of ser.:	ECS transactions
Ser. no.:	13(1)

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