1.

Conference Proceedings
Conference Proceedings
1. High-density optical interconnect using polymer waveguides interfaced to a VCSEL array in molded plastic packaging (Invited Paper)
Liu,Y.S. ; Wojnarowski,R.J. ; Hennessy,W.A. ; Piacente,P.A. ; Rowlette,Sr.,J.R. ; Kadar-Kallen,M.A. ; Stack,J.D. ; Liu,Y. ; Peczalski,A. ; Nahata,A.
Pub. info.: Optoelectronic Interconnects V.  pp.60-72,  1998.  Bellingham, Wash..  SPIE-The International Society for Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 3288
2.

Conference Proceedings
Conference Proceedings
2. MCM board level optical interconnects using passive polymer waveguides with hybrid optical and electrical multichip module packaging
Bristow,J.P. ; Liu,Y. ; Marta,T. ; Johnson,K. ; Hanzal,B.R. ; Peczalski,A. ; Bounnak,S. ; Liu,Y.S. ; Cole,H.S.
Pub. info.: Optoelectronic Packaging.  pp.18-24,  1996.  Bellingham, Wash..  SPIE-The International Society for Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 2691
3.

Conference Proceedings
Conference Proceedings
3. Polymer optical waveguide technology for multichip modules(MCMs)and board-level interconnects
Liu,Y. ; Bristow,J.P.G. ; Johnson,K. ; Peczalski,A. ; Marta,T. ; Bounnak,S. ; Goldberg,W.T. ; Hanzel,B.
Pub. info.: Integrated Optoelectronics.  pp.88-95,  1996.  Bellingham, Wash..  SPIE-The International Society for Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 2891