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12 results

Conference Proceedings

1. The use of process models to enhance device performance through semiconductor design [6156-44]

Melvin III, L. S. ; Zhang, D.

Pub. info.:	Design and process integration for microelectronic manufacturing IV : 23-24 February, 2006, San Jose, California, USA. pp.61560J-, 2006. Bellingham, Wash.. SPIE - The International Society of Optical Engineering
Title of ser.:	Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:	6156

Conference Proceedings

2. Lithography window check before mask tape-out in sub-O.18um technology [6156-31]

Lu, M. ; King, D. ; Li, F. ; Mao, Z. ; Liang, C. ; Melvin III, L. S.

Pub. info.:	Design and process integration for microelectronic manufacturing IV : 23-24 February, 2006, San Jose, California, USA. pp.61560X-, 2006. Bellingham, Wash.. SPIE - The International Society of Optical Engineering
Title of ser.:	Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:	6156

Conference Proceedings

3. Line end design intent estimation using curves

Hung, C. -Y. ; Gao, G. ; Zhang, S. ; Deng, Z. -X. ; Cork, C. ; Melvin III, L. S. ; Jiang, Y.

Pub. info.:	Design and process integration for microelectronic manufacturing III : 3-4 March 2005, San Jose, California, USA. pp.413-418, 2005. Bellingham, Wash.. SPIE - The International Society of Optical Engineering
Title of ser.:	Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:	5756

Conference Proceedings

4. Detecting focus-sensitive configurations during OPC

Melvin III, L. S. ; Shiely, J. P. ; Yan, Q.

Pub. info.:	Design and process integration for microelectronic manufacturing III : 3-4 March 2005, San Jose, California, USA. pp.255-261, 2005. Bellingham, Wash.. SPIE - The International Society of Optical Engineering
Title of ser.:	Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:	5756

Conference Proceedings

5. The use of optical proximity correction to compensate for reflectivity differences in N type and P type poly-silicon [6156-37]

Melvin III, L. S. ; Huang, J.

Pub. info.:	Design and process integration for microelectronic manufacturing IV : 23-24 February, 2006, San Jose, California, USA. pp.61561F-, 2006. Bellingham, Wash.. SPIE - The International Society of Optical Engineering
Title of ser.:	Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:	6156

Conference Proceedings

6. Process model quality assessment by sensitivity analysis [5853-53]

Yan, Q. ; Melvin III, L. S. ; Shiely, J. P.

Pub. info.:	Photomask and Next-Generation Lithography Mask Technology XII. pp.686-692, 2005. Bellingham, Wash.. SPIE - The International Society of Optical Engineering
Title of ser.:	Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:	5853

Conference Proceedings

7. Model-based placement and optimization of subresolution assist features [6154-86]

Barnes, L. D. ; Painter, B. D. ; Melvin III, L. S.

Pub. info.:	Optical Microlithography XIX. pp.61542C-, 2006. Bellingham, Wash.. SPIE - The International Society of Optical Engineering
Title of ser.:	Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:	6154

Conference Proceedings

8. Applying assist features to improve two dimensional feature process robustness [5992-60]

Melvin III, L. S. ; painter, B. D. ; Barnes, L. D.

Pub. info.:	25th Annual BACUS Symposium on Photomask Technology. pp.59921N-, 2005. Bellingham, Wash.. SPIE - The International Society of Optical Engineering
Title of ser.:	Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:	5992

Conference Proceedings

9. Maintaining lithographic quality during OPC for low-k1 and MEEF processes constrained by mask dimensional rules

Cork, C. M. ; Melvin III, L. S. ; Milier, M. ; Lugg, R. M. ; Rieger, M. L.

Pub. info.:	24th Annual BACUS Symposium on Photomask Technology. pp.1161-1167, 2004. Bellingham, Wash.. SPIE - The International Society of Optical Engineering
Title of ser.:	Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:	5567

10.

Conference Proceedings

10. Extension of 193 nm dry lithography to 45-nm half-pitch node: double exposure and double processing technique [6349-62]

Biswas, A. M. ; Li, J. ; Hiserote, J. A. ; Melvin III, L. S.

Pub. info.:	Photomask Technology 2006. pp.63491P-, 2006. Bellingham, Wash.. SPIE - The International Society of Optical Engineering
Title of ser.:	Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:	6349

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