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Conference Proceedings

1. Toward a universal resist dissolution model for lithography simulation

Robertson,S.A. ; Mack,C.A. ; Maslow,M.J.

Pub. info.:	Lithography for semiconductor manufacturing II : 30 May-1 June, 2001, Edinburgh, UK. pp.111-122, 2001. Bellingham, Wash.. SPIE-The International Society for Optical Engineering
Title of ser.:	Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:	4404

Conference Proceedings

2. Effect of developer temperature and normality on conventional and chemically amplified photoresist dissolution

Mack,C.A. ; Maslow,M.J. ; Byers,J.D.

Pub. info.:	Lithography for semiconductor manufacturing : 19-21 May 1999, Edinburgh, Scotland. pp.148-160, 1999. Bellingham, Wash.. SPIE - The International Society for Optical Engineering
Title of ser.:	Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:	3741

Conference Proceedings

3. New model for the effect of developer temperature on photoresist dissolution

Mack,C.A. ; Maslow,M.J. ; Sekiguchi,A. ; Carplo,R.A.

Pub. info.:	Advances in resist technology and processing XV : 23-25 February 1998, Santa Clara, California. Part 2 pp.1218-1231, 1998. Bellingham, Wash., USA. SPIE-The International Society for Optical Engineering
Title of ser.:	Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:	3333

Conference Proceedings

4. SPM characterizaton of anomalies in phase-shift mask and their effect on wafer features

Muckenhirn,S. ; Meyyappan,A. ; Walch,K. ; Maslow,M.J. ; Vandenberghe,G.N. ; Wingerden,J.Van

Pub. info.:	Metrology, Inspection, and Process Control for Microlithography XV. pp.188-199, 2001. Bellingham, Wash.. SPIE-The International Society for Optical Engineering
Title of ser.:	Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:	4344