1.

Conference Proceedings
Conference Proceedings
1. All-Wet Strip Approaches for Post-Etch Photoresist Layers After Low-K Patterning
M. Claes ; Q. Le ; E. Kesters ; M. Lux ; A. Urionabarrenetxea
Pub. info.: Cleaning and surface conditioning technology in semiconductor device manufacturing 10.  pp.177-187,  2007.  Pennington, N.J..  Electrochemical Society
Title of ser.: ECS transactions
Ser. no.: 11(2)
2.

Conference Proceedings
Conference Proceedings
2. MANAGEMENT OF METALLIC CONTAMINATION IN ADVANCED IC MANUFACTURING
A. Danel ; D. Renaud ; P. Besson ; C. Bigot ; A. Groujilet ; J. P. Joly ; M. Claes ; T. Bearda ; J. Frickinger
Pub. info.: Cleaning Technology in Semiconductor Device Manufacturing IX.  pp.3-10,  2006.  Pennington, NJ.  Electrochemical Society
Title of ser.: ECS transactions
Ser. no.: 1(3)
3.

Conference Proceedings
Conference Proceedings
3. Wet Etch Characteristics of Hafnium Silicate Layers
M. Claes ; V. Paraschiv ; D. Dictus ; T. Conard ; W. Boullari ; S. Vanhaelemeersch ; S. De Gendt ; A. Delabie ; S. Van Elshoclst ; C. Zhao ; J. Everaert
Pub. info.: Physics and technology of high-k gate dielectrics III.  pp.633-644,  2006.  Pennington, N.J..  Electrochemical Society
Title of ser.: ECS transactions
Ser. no.: 1(5)