1.

Conference Proceedings
Conference Proceedings
1. Copper-Diffusion-Resistance Treatment by NH3 Plasma for Organic Low-k Methylsilsesquioxane/Copper Interface
Chang, T.C. ; Perng, T.H. ; Liu, P.T. ; Sze, S.M. ; Chang, C.Y.
Pub. info.: Interconnect and contact metallization for ULSI : proceedings of the international symposium.  pp.232-240,  1999.  Pennington, N.J..  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 99-31
2.

Conference Proceedings
Conference Proceedings
2. Structural and Electrical Characteristics of Low Dielectric Cosntant Porous Hydrogen Silsequioxane for Cu Metallization
Wang, J.H. ; Liu, P.T. ; Chang, T.C. ; Chen, W.J. ; Cheng, S.L. ; Lin, J.Y. ; Chen, L.J.
Pub. info.: Thin film materials, processes, and reliability, plasma processing for the 100 nm node and copper interconnects with low-k inter-level dielectric films : proceedings of the international symposium.  pp.216-223,  2003.  Pennington, N.J..  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2003-13
3.

Conference Proceedings
Conference Proceedings
3. Characteristics of Low-k Methyl-Silsesquiazane (MSZ) for CMP Process Using Oxygen Plasma Treatment
Liu, P.T. ; Chang, T.C. ; Tsai, T.M. ; Yan, S.T ; Chang, Y.C. ; Acki, H. ; Tseng, T.Y.
Pub. info.: Thin film materials, processes, and reliability, plasma processing for the 100 nm node and copper interconnects with low-k inter-level dielectric films : proceedings of the international symposium.  pp.237-243,  2003.  Pennington, N.J..  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2003-13