1.

Conference Proceedings
Conference Proceedings
1. Chemical Mechanical Planarization of Ruthenium for Capacitor Bottom Electrode in DRAM Technology
Lee, S-H. ; Kang, Y-J ; Park, J-G. ; Lee, S-I.
Pub. info.: Thin film materials, processes, and reliability, plasma processing for the 100 nm node and copper interconnects with low-k inter-level dielectric films : proceedings of the international symposium.  pp.304-310,  2003.  Pennington, N.J..  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2003-13
2.

Conference Proceedings
Conference Proceedings
2. 52. Atomic Layer Deposition of high-k metal oxides for gate and capacitor dielectrics
Senzaki, Y. ; Pork, S. G. ; Iliguchi, R. ; Chotliom, H. ; Bortholomew, L. ; Al-Lomi, S. ; Borelli, C. ; Lee, S-I. ; Helms, A., Jr.
Pub. info.: Advanced short-time thermal processing for Si-based CMOS devices : proceedings of the international symposium.  pp.423-428,  2003.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2003-14