1.

Conference Proceedings
Conference Proceedings
1. Dipole decomposition mask design for full-chip implementation at 100-nm technology node and beyond
Hsu, S.D. ; Corcoran, N.P. ; Eurlings, M. ; Knose, W.T. ; Laidig, T.L. ; Wampler, K.E. ; Roy, S. ; Shi, X. ; Hsu, C.M. ; Chen, J.F. ; Finders, J. ; Socha, R.J. ; Dusa, M.V.
Pub. info.: Optical Microlithography XV.  Part One  pp.476-490,  2002.  Bellingham, Wash..  SPIE-The International Society for Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 4691
2.

Conference Proceedings
Conference Proceedings
2. 65-nm full-chip implementation using double dipole lithography
Hsu, S.D. ; Chen, J.F. ; Cororan, N. ; Knose, W.T. ; Broeke, D.J.V.D. ; Laidig, T.L. ; Wampler, K.E. ; Shi, X. ; Hsu, C.M. ; Eurlings, M. ; Finders, J. ; Chiou, T.-B. ; Socha, R.J. ; Conley, W. ; Hsieh, Y.W. ; Tuan, S. ; Hsieh, F.
Pub. info.: Optical Microlithography XVI.  Part One  pp.215-231,  2003.  Bellingham, Wash..  SPIE-The International Society for Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 5040
3.

Conference Proceedings
Conference Proceedings
3. Reticle defect printability for sub-0.3k1 chromeless phase lithography (CPL) technology
Hsu, S. ; Van Den Broeke, D.J. ; Shi, X. ; Chen, J.F. ; Knose, W.T. ; Corcoran, N.P. ; Vedula, S. ; MacNaughton, C.W. ; Richie, M.
Pub. info.: Photomask and Next-Generation Lithography Mask Technology IX.  pp.373-383,  2002.  Bellingham, Wash..  SPIE-The International Society for Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 4754