1.

Conference Proceedings
Conference Proceedings
1. Stabilization of Low Dielectric Constant SiOF Films by Post-Deposition Annealing
Kim, H.-H. ; Lee, S.-K. ; Kim, S.-O. ; Kim, Y.-H. ; Kim, H.J. ; Sohn, Y.-S. ; Yang, H.-S. ; Kim, C.-T. ; Kim, D.H.
Pub. info.: Proceedings of the Second International Symposium on Low and High Dielectric Constant Materials : Materials Science, Processing, and Reliability Issues.  pp.126-135,  1997.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 97-8
2.

Conference Proceedings
Conference Proceedings
2. Deposition and Characterization of SiOF Films for Multi-level IMD
Kim, H.-H. ; Lee, S.-K. ; Kim, S.-O. ; Kim, Y.-H. ; Kim, H.J. ; Sohn, Y.-S. ; Yang, H.-S. ; Kim, C.-T. ; Kim, D.-H.
Pub. info.: Proceedings of the Second International Symposium on Low and High Dielectric Constant Materials : Materials Science, Processing, and Reliability Issues.  pp.148-156,  1997.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 97-8
3.

Technical Paper
Technical Paper
3. Thermal Sizing Analysis for a Copper Bonded Steam Generator in LMR.
Kim, E.-K. ; Kim, Y.-S. ; Eoh, J.-H. ; Kim, S.-O.
Pub. info.: A.S.M.E. paper.  2003.  New York, NY.  American Society of Mechanical Engineers
Title of ser.: ASME Technical Paper : HT
Ser. no.: 2003
4.

Conference Proceedings
Conference Proceedings
4. Synthesis and evaluation of novel organoelement resists for EUV lithography
Dai, J. ; Ober, C.K. ; Kim, S.-O. ; Nealey, P.F. ; Golovkina, V. ; Shin, J. ; Wang, L. ; Cerrina, F.
Pub. info.: Advances in Resist Technology and Processing XX.  2  pp.1164-1172,  2003.  Bellingham, CA.  SPIE-The International Society for Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 5039