1.

Conference Proceedings
Conference Proceedings
1. THE EFFECTS OF pH ADJUSTORS IN POST Cu CMP CLEANING SOLUTIONS ON PARTICLE ADHESION AND REMOVAL
Y.-K. Hong ; J.-H. Song ; Y.-J. Kang ; I.-K. Kim ; J.-G. Park ; H.-S. Song ; K.-S. Kim ; J.-J. Myung ; H.-J. Lee ; S.-Y. Song
Pub. info.: Cleaning Technology in Semiconductor Device Manufacturing IX.  pp.333-340,  2006.  Pennington, NJ.  Electrochemical Society
Title of ser.: ECS transactions
Ser. no.: 1(3)
2.

Conference Proceedings
Conference Proceedings
2. Enhancement of Film Cooling Performance at the Leading Edge of Turbine Blade
K.-S. Kim ; Youn J. Kim ; S.-M. Kim
Pub. info.: Heat Transfer, Parts A and B; Volume 3.  3A  pp.307-314,  2006.  New York.  American Society of Mechanical Engineers
Title of ser.: ASME Symposia Volumes
Ser. no.: TURBO EXPO 2006(3A)