1.

Conference Proceedings
Conference Proceedings
1. Effects of Basal Plane Dislocation Density in 4H-SiC Substrate on Degradation of Body-Diode Forward Voltage
N. Kawabata ; A. Tanaka ; M. Tsujimura ; Y. Ueji ; K. Omote
Pub. info.: Silicon Carbide and Related Materials 2015 : [ICSCRM 2015] : selected, peer reviewed papers from the 16th International Conference on Silicon Carbide and Related Materials, October 4-9, 2015, Giardini Naxos, Italy.  pp.384-388,  2016.  Aedermannsdorf, Switzerland.  Trans Tech Publications
Title of ser.: Materials science forum
Ser. no.: 858
2.

Conference Proceedings
Conference Proceedings
2. Comparison of Internal and Residual Stresses Measured by Strain-Dip Test and XRD during High Temperature Deformation of Al-Mg Solid Solutions
H. Sato ; Y. Enomoto ; K. Omote ; S.I. Tanaka
Pub. info.: International Conference on Residual Stresses 9 (ICRS 9) : Selected, peer reviewed papers from the 9th International Conference on Residual Stresses (ICRS 9), October 7-9, 2012, Garmisch-Partenkirchen, Germany.  pp.351-357,  2014.  Aedermannsdorf, Switzerland.  Trans Tech Publications
Title of ser.: Materials science forum
Ser. no.: 768-769
3.

Conference Proceedings
Conference Proceedings
3. Extrapolation of Creep Curve and Creep Rate by Strain Acceleration Parameter in Al-Mg Solid Solution Alloys
H. Sato ; K. Omote ; A. Sato
Pub. info.: Aluminium Alloys 2014 - ICAA14 : Selected, peer reviewed papers from the 14th International Conference on Aluminium Alloys (ICAA14), June 15-19, 2014, Trondheim, Norway.  pp.307-312,  2014.  Aedermannsdorf, Switzerland.  Trans Tech Publications
Title of ser.: Materials science forum
Ser. no.: 794-796
4.

Conference Proceedings
Conference Proceedings
4. Demonstration of 13-kV Class Junction Barrier Schottky Diodes in 4H-SiC with Three- Zone Junction Termination Extension
H. Kitai ; Y. Hozumi ; H. Shiomi ; M. Furumai ; K. Omote ; K. Fukuda
Pub. info.: Silicon Carbide and Related Materials 2016.  pp.451-454,  2017.  Aedermannsdorf, Switzerland.  Trans Tech Publications
Title of ser.: Materials science forum
Ser. no.: 897