1.

Conference Proceedings
Conference Proceedings
1. Experimental Study for Underfill of Flip Chip Packages
Jong, W-R. ; Chen, S. ; Lai, C. ; Tsai, H. ; Liu, H. ; Ho, S. ; Lo, W-Y.
Pub. info.: ANTEC 2003, annual technical conference, May 4-8, Nashville, Tennessee.  pp.1335-1341,  2003.  Brookfield Center, Conn..  Society of Plastics Engineers
Title of ser.: Annual Technical Conference - ANTEC : Society of Plastics Engineers Annual Technical Papers
Ser. no.: 61
2.

Conference Proceedings
Conference Proceedings
2. 3D CAE Simulation and Verification for the Ferrule of MT-Rj Fiber Connector
Jong, W-R. ; Chen, S.C. ; Hung, S. ; Chung, M. ; Kuo, T. ; Ho, S.
Pub. info.: ANTEC 2003, annual technical conference, May 4-8, Nashville, Tennessee.  pp.746-751,  2003.  Brookfield Center, Conn..  Society of Plastics Engineers
Title of ser.: Annual Technical Conference - ANTEC : Society of Plastics Engineers Annual Technical Papers
Ser. no.: 61