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Conference Proceedings

1. Analysis on Contact Forms of Interface in Wafer CMP Based on Lubricating Behavior

S.F. Zhang ; J.X. Su ; J.X. Du ; R.K. Kang

Pub. info.:	Physical and Numerical Simulation of Material Processing VI : Selected, peer reviewed papers from the 6th International Conference on Physical and Numerical Simulation of Materials Processing (ICPNS 2010), November 16-19, 2010, Guilin, China. pp.313-317, 2012. Aedermannsdorf, Switzerland. Trans Tech Publications
Title of ser.:	Materials science forum
Ser. no.:	704-705

Conference Proceedings

2. Study on Slurry of Chemical Mechanical Polishing 304 Stainless Steel Based on Ferric Chloride and Oxalic Acid

J.X. Su ; J.P. Chen ; Q. Li ; H.Q. Qin

Pub. info.:	Advances in Materials Processing XII : selected, peer reviewed papers from the 12th Asia-Pacific Conference on Materials Processing (APCMP2016), June 16-19, 2016, Qingdao, China. pp.102-107, 2016. Aedermannsdorf, Switzerland. Trans Tech Publications
Title of ser.:	Materials science forum
Ser. no.:	861

Conference Proceedings

3. Photocatalytic Performance of Polyoxometallate Intercalated Layered Double Hydroxide

Y.H. Zhang ; J.X. Su ; X.P. Wang ; Q. Pan ; W. Qu

Pub. info.:	Optoelectronic materials : Selected, peer reviewed papers from the 2010 International Conference on Optical, Electronic and Electrical Materials, August 1-4, Kunming, China, OEEM 2010. pp.187-190, 2010. Aedermannsdorf, Switzerland. Trans Tech Publications
Title of ser.:	Materials science forum
Ser. no.:	663-665

Conference Proceedings

4. Analysis on the Action of Oxidant in Chemical Mechanical Polishing of 304 Ultra-Thin Stainless Steel

J.X. Su ; Y.A. Peng ; Z.H. Liu ; Z.K. Wang ; S.F. Fu

Pub. info.:	Mechanical Engineering, Materials Science and Civil Engineering IV. pp.234-239, 2017. Aedermannsdorf, Switzerland. Trans Tech Publications
Title of ser.:	Materials science forum
Ser. no.:	893