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12 results

Conference Proceedings

1. Thermal and Electromigration Strain Distributions in 10-ｦﾌm-Wide Aluminum Conductor Lines Measured by X-ray Microdiffraction

Wang, P-C. ; Cargill, G. S., III. ; Noyan, I. C. ; Liniger, E. G. ; Hu, C-K. ; Lee, K. Y.

Pub. info.:	Materials reliability in microelectronics VII : symposium held April 8-12, 1997, San Francisco, California, U.S.A.. pp.273-, 1997. Pittsburgh, Pa.. MRS - Materials Research Society
Title of ser.:	Materials Research Society symposium proceedings
Ser. no.:	473

Conference Proceedings

2. Electromigration and Diffusion in Pure Cu and Cu(Sn) Alloys

Hu, C-K. ; Lee, K. L. ; Gupta, D. ; Blauner, P.

Pub. info.:	Materials reliability in microelectronics VI : symposium held April 8-12, 1996, San Francisco, California, U.S.A.. pp.43-, 1996. Pittsburgh, Pa.. MRS - Materials Research Society
Title of ser.:	Materials Research Society symposium proceedings
Ser. no.:	428

Conference Proceedings

3. Local and Global Stress Distributions in BEOL Metallization

Noyan, I. C. ; Liniger, E. G. ; Hu, C-K. ; Wang, P-C. ; Cargill, G. S., III

Pub. info.:	Materials reliability in microelectronics VI : symposium held April 8-12, 1996, San Francisco, California, U.S.A.. pp.565-, 1996. Pittsburgh, Pa.. MRS - Materials Research Society
Title of ser.:	Materials Research Society symposium proceedings
Ser. no.:	428

Conference Proceedings

4. Extendibility of Cu Damascene to 0.1 ｦﾌm Wide Interconnections

Hu, C-K. ; Lee, K. Y. ; Gignac, L. ; Rossnagel, S. M. ; Uzoh, C. ; Chan, K. ; Roper, P. ; Harper, J. M. E.

Pub. info.:	Advanced interconnects and contact materials and processes for future integrated circuits : symposium held April 13-16, 1998, San Francisco, California, U.S.A.. pp.287-, 1998. Warrendale, Pa.. MRS - Materials Research Society
Title of ser.:	Materials Research Society symposium proceedings
Ser. no.:	514

Conference Proceedings

5. Copper Migration and Precipitate Dissolution in Aluminum/Copper Lines During Electromigration Testing

Shaw, T. M. ; Hu, C-K. ; Lee, K. Y. ; Rosenberg, R.

Pub. info.:	Materials reliability in microelectronics VI : symposium held April 8-12, 1996, San Francisco, California, U.S.A.. pp.187-, 1996. Pittsburgh, Pa.. MRS - Materials Research Society
Title of ser.:	Materials Research Society symposium proceedings
Ser. no.:	428

Conference Proceedings

6. Reliability and Copper Interconnections with Low-Dielectric Constant Materials

Hu, C-K.

Pub. info.:	Low-dielectric constant materials IV : symposium held April 14-16, 1998, San Francisco, California, U.S.A.. pp.305-, 1998. Warrendale, Pa.. MRS - Materials Research Society
Title of ser.:	Materials Research Society symposium proceedings
Ser. no.:	511

Conference Proceedings

7. In Situ X-ray Microbeam Cu Fluorescence and Strain Measurements on Al(0.5 at.% Cu) Conductor Lines During Electromigration

Kao, H-K. ; Cargill, G. S., III. ; Hwang, K. J. ; Ho, A. C. ; Wang, P-C. ; Hu, C-K.

Pub. info.:	Materials reliability in microelectronics IX : symposium held April 6-8, 1999, San Francisco, California, U.S.A.. pp.163-, 1999. Pittsburgh, Pa.. MRS - Materials Research Society
Title of ser.:	Materials Research Society symposium proceedings
Ser. no.:	563

Conference Proceedings

8. X-ray Microbeam Studies of Electromigration

Cargill, G. S., III. ; Ho, A. C. ; Hwang, K. J. ; Kao, H. K. ; Wang, P-C. ; Hu, C-K.

Pub. info.:	Materials reliability in microelectronics IX : symposium held April 6-8, 1999, San Francisco, California, U.S.A.. pp.153-, 1999. Pittsburgh, Pa.. MRS - Materials Research Society
Title of ser.:	Materials Research Society symposium proceedings
Ser. no.:	563

Conference Proceedings

9. ELECTROMIGRATION IN Al/W AND Al(Cu)/W INTERCONNECT STRUCTURES

Hu, C-K. ; Ho, P. S. ; Small, M. B. ; Kelleher, K.

Pub. info.:	Materials reliability issues in microelectronics : symposium held April 30-May 3, 1991, Anaheim, California, U.S.A.. pp.99-106, 1991. Pittsburgh, Pa.. Materials Research Society
Title of ser.:	Materials Research Society symposium proceedings
Ser. no.:	225

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Conference Proceedings

10. MANUFACTURABILITY VERSUS RELIABILITY ISSUES RELEVANT TO INTERCONNECT METALLIZATIONS

Rodbell, K. P. ; Colgan, E. G. ; Hu, C-K.

Pub. info.:	Advanced metallization for devices and circuits--science, technology, and manufacturability : symposium held April 4-8, 1994, San Francisco, California, U.S.A.. pp.59-, 1994. Pittsburgh, Pa.. MRS - Materials Research Society
Title of ser.:	Materials Research Society symposium proceedings
Ser. no.:	337

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Author: Hu, C-K.