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12 results

Conference Proceedings

1. Electromigration in Submicron Copper Lines Deposited by Chemical Vapor Deposition and Physical Vapor Deposition Techniques

Hu, C.-K. ; Malhotra, S.G. ; Gignac, L.

Pub. info.:	Interconnect and contact metallization for ULSI : proceedings of the international symposium. pp.206-213, 1999. Pennington, N.J.. Electrochemical Society
Title of ser.:	Electrochemical Society Proceedings Series
Ser. no.:	99-31

Conference Proceedings

2. Dopants in Electroplated Copper

Andricacos, P.C. ; Parks, C. ; Cabral, C. ; Wachnik, R. ; Tsai, R. ; Maihotra, S. ; Locke, P. ; Fluegel, J. ; Horkans, J. ; Kwietniak, K. ; Uzoh, C. ; Rodbell, K.P. ; Gignac, L. ; Walton, E. ; Chung, D. ; Geffren, R.

Pub. info.:	Electrochemical processing in ULSI fabrication and semiconductor/metal deposition II : proceedings of the international symposium. pp.111-121, 1999. Pennington, N.J.. Electrochemical Society
Title of ser.:	Electrochemical Society Proceedings Series
Ser. no.:	99-9

Conference Proceedings

3. Electromigration in on-chip Single/dual Damascene Cu interconnections*

Hu, C.-K ; Gignac, L. ; Liniger, E. ; Rosenberg, R.

Pub. info.:	Semiconductor technology (ISTC 2001) : proceedings of the 1st International Conference on Semiconductor Technology. pp.387-397, 2001. Pennington, N.J.. Electrochemical Society
Title of ser.:	Electrochemical Society Proceedings Series
Ser. no.:	2001-17

Conference Proceedings

4. The Stability of SiGe Strained Layers on Small Area Trench Isolated Silicon Islands

Schonenberg, K. ; Harame, D.L. ; Gilbert, M. ; Stanis, C. ; Gignac, L. ; Chan, S.

Pub. info.:	Proceedings of the Fourth International Symposium on Process Physics and Modeling in Semiconductor Technology. pp.298-308, 1996. Pennington, NJ. Electrochemical Society
Title of ser.:	Electrochemical Society Proceedings Series
Ser. no.:	96-4

Conference Proceedings

5. Mechanisms for Microstructure Evolution in Electroplated Copper Thin Films

Harper, J. M. E. ; Cabral, C., Jr. ; Andricacos, P. C. ; Gignac, L. ; Noyan, I. C. ; Rodbell, K. P. ; Hu, C. K.

Pub. info.:	Advanced interconnects and contacts : symposium held April 5-7, 1999, San Francisco, California, U.S.A.. pp.387-, 1999. Warrendale, Pa.. MRS - Materials Research Society
Title of ser.:	Materials Research Society symposium proceedings
Ser. no.:	564

Conference Proceedings

6. In Situ Study of Ti/TiN Stability Under Nitrogen Anneal

DeHaven, P. W. ; Rodbell, K. P. ; Gignac, L.

Pub. info.:	Advanced interconnects and contacts : symposium held April 5-7, 1999, San Francisco, California, U.S.A.. pp.465-, 1999. Warrendale, Pa.. MRS - Materials Research Society
Title of ser.:	Materials Research Society symposium proceedings
Ser. no.:	564

Conference Proceedings

7. Extendibility of Cu Damascene to 0.1 ｦﾌm Wide Interconnections

Hu, C-K. ; Lee, K. Y. ; Gignac, L. ; Rossnagel, S. M. ; Uzoh, C. ; Chan, K. ; Roper, P. ; Harper, J. M. E.

Pub. info.:	Advanced interconnects and contact materials and processes for future integrated circuits : symposium held April 13-16, 1998, San Francisco, California, U.S.A.. pp.287-, 1998. Warrendale, Pa.. MRS - Materials Research Society
Title of ser.:	Materials Research Society symposium proceedings
Ser. no.:	514

Conference Proceedings

8. Characterization of Thin Dielectric Films as Copper Diffusion Barriers Using Triangular Voltage Sweep

Cohen, S. A. ; Liu, J. ; Gignac, L. ; Ivers, T. ; Armbrust, D. ; Rodbell, K. P. ; Gates, S. M.

Pub. info.:	Advanced interconnects and contacts : symposium held April 5-7, 1999, San Francisco, California, U.S.A.. pp.551-, 1999. Warrendale, Pa.. MRS - Materials Research Society
Title of ser.:	Materials Research Society symposium proceedings
Ser. no.:	564

Conference Proceedings

9. Mechanisms for Microstructure Evolution in Electroplated Copper Thin Films

Cabral, C. ; Gignac, L. ; Harper, J. N. E. ; Hu, C. K. ; Noyan, I. C. ; ricacos, P. C. ; Rodbell, K. P.

Pub. info.:	Polycrystalline metal and magnetic thin films : symposium held April 5-8, 1999, San Francisco, California, U.S.A.. pp.223-228, 1999. Warrendale, PA. Materials Research Society
Title of ser.:	Materials Research Society symposium proceedings
Ser. no.:	562

10.

Conference Proceedings

10. Characterization of Thin Dielectric Films as Copper Diffusion Barriers Using Triangular Voltage Sweep

Armbrust, D. ; Cohen, S. A. ; Gates, S. M. ; Gignac, L. ; Ivers, T. ; Liu, J. ; Rodbell, K. P.

Pub. info.:	Low-dielectric constant materials V : symposium held April 5-8, 1999, San Francisco, California, U.S.A.. pp.189-196, 1999. Warrendale, Pa.. Materials Research Society
Title of ser.:	Materials Research Society symposium proceedings
Ser. no.:	565

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Author: Gignac, L.