1.

Conference Proceedings
Conference Proceedings
1. RAMAN SPECTROSCOPY STUDY OF DAMAGE IN n+ - GaAs INTRODUCED BY H2 AND CH4/H2 RIE
De Wolf, I. ; Van Hove, M. ; Pereira, R. -G. ; Van Rossum, M. ; Maes, H. E. ; Munder, H.
Pub. info.: Advanced III-V compound semiconductor growth, processing and devices : symposium held Decmber[i.e. December] 2-5, 1991, Boston, Massachusetts, U.S.A..  pp.355-360,  1992.  Pittsburgh, Pa..  Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 240
2.

Conference Proceedings
Conference Proceedings
2. Optimization of Polysilicon-Encapsulated LOCOS for 0.25 μm CMOS: Correlation Between Stress and Gate Oxide Integrity
Badenes, G. ; Rooyackers, R. ; De Wolf, I. ; Deferm, L.
Pub. info.: ULSI science and technology, 1997 : proceedings of the Sixth International Symposium on Ultralarge Scale Integration Science and Technology.  pp.467-478,  1997.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 97-3
3.

Conference Proceedings
Conference Proceedings
3. Laser joining of glass to silicon using adhesive for MEMS packaging applications [6107-02]
Bardin, F. ; Kloss, S. ; Wang, C. H. ; Moore, A. ; Jourdain, A. ; De Wolf, I. ; Hand, D. P.
Pub. info.: Laser-based Micropackaging.  pp.610702-,  2006.  Bellingham, Wash..  SPIE - The International Society of Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 6107
4.

Conference Proceedings
Conference Proceedings
4. The reliability of RF-MEMS: failure modes, test procedures, and instrumentation
De Wolf, I.
Pub. info.: Reliability, Testing, and Characterization of MEMS/MOEMS III.  pp.1-8,  2004.  Bellingham, Wash..  SPIE - The International Society of Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 5343
5.

Conference Proceedings
Conference Proceedings
5. Numerical analysis of the process-induced stresses in silicon microstructures
Senez, V. ; Hoffmann, T. ; Armigliato, A. ; De Wolf, I.
Pub. info.: Microelectronics: Design, Technology, and Packaging.  pp.350-361,  2004.  Bellingham, Wash..  SPIE - The International Society of Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 5274