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12 results

Technical Paper

1. An incremental damage superposition approach for reliability of electronic interconnects under combined accelerated stresses

Upadhyayula, Kumar ; Dasgupta, Abhijit

Pub. info.:	A.S.M.E. paper. 1997. New York. The American Society of Mechanical Engineers
Title of ser.:	ASME Technical Paper : WA/EEP
Ser. no.:	1997

Technical Paper

2. Surface mount technology

Graham, Glenn ; Brown, Dick ; Spigarelli, Donald ; Marcos, Stephen ; Tashjian, Gregory ; Dasgupta, Abhijit

Pub. info.:

SME technical paper series. pp.1P-, 1991. Society of Manufacturing Engineers

Technical Paper

3. Simulation of the influence of manufacturing quality on reliability of vias

Ramappan, Vijay ; Dasgupta, Abhijit

Pub. info.:	A.S.M.E. paper. 1994. New York. The American Society of Mechanical Engineers
Title of ser.:	ASME Technical Paper : WA/EEP
Ser. no.:	1994

Technical Paper

4. A nested finite element methodology (NFEM) for stress analysis of flip chip on board assemblies - part II: Viscoplastic analysis

Darbha, Krishna ; Dasgupta, Abhijit

Pub. info.:	A.S.M.E. paper. 1999. New York. The American Society of Mechanical Engineers
Title of ser.:	ASME Technical Paper : IMECE/EEP
Ser. no.:	1999

Technical Paper

5. Effect of SMC lead dimensional variabilities on lead compliance and solder joint fatigue life

Barker, Donald B. ; Sharif, Irfan ; Dasgupta, Abhijit ; Pecht, M. G.

Pub. info.:	A.S.M.E. paper. 1991. New York, NY. The American Society of Mechanical Engineers
Title of ser.:	ASME Technical Paper : WA/EEP
Ser. no.:	1991

Technical Paper

6. Fatigue analysis of a planarpak surface mount component

Sharif, Irfan ; Barker, Donald B. ; Dasgupta, Abhijit ; Pecht, Michael G.

Pub. info.:	A.S.M.E. paper. 1990. New York, NY. The American Society of Mechanical Engineers
Title of ser.:	ASME Technical Paper : WA/EEP
Ser. no.:	1990

Technical Paper

7. Viscoplastic characterization of constitutive behavior of two solder alloys

Haswell, Peter ; Dasgupta, Abhijit

Pub. info.:	A.S.M.E. paper. 1999. New York. The American Society of Mechanical Engineers
Title of ser.:	ASME Technical Paper : IMECE/EEP
Ser. no.:	1999

Technical Paper

8. Effect of underfill in flip chip on board assemblies

Okura, Juscelino H. ; Darbha, Krishna ; Dasgupta, Abhijit

Pub. info.:	A.S.M.E. paper. 1998. New York. The American Society of Mechanical Engineers
Title of ser.:	ASME Technical Paper : WA/EEP
Ser. no.:	1998

Technical Paper

9. Modeling PTH damage caused by insertion mount connectors

Ganguly, Gautam ; Dasgupta, Abhijit

Pub. info.:	A.S.M.E. paper. 1994. New York. The American Society of Mechanical Engineers
Title of ser.:	ASME Technical Paper : WA/EEP
Ser. no.:	1994

10.

Technical Paper

10. Stress analysis of glass-to-metal lead seals

Mathieu, Barry ; Dasgupta, Abhijit

Pub. info.:	A.S.M.E. paper. 1993. New York, NY. The American Society of Mechanical Engineers
Title of ser.:	ASME Technical Paper : WA/EEP
Ser. no.:	1993

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