1.

Conference Proceedings
Conference Proceedings
1. Lifetime Characterization of Polysilicon Back-Sealed Wafers with Bi-Surface Photoconductivity Decay Method
Ogita, Y. ; Uematsu, Y. ; Daio, H.
Pub. info.: Science and technology of semiconductor surface preparation : symposium held April 1-3, 1997, San Francisco, California, U.S.A..  pp.329-,  1997.  Pittsburgh, Pa..  MRS - Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 477
2.

Conference Proceedings
Conference Proceedings
2. Temperature Dependence of Effective Lifetime for N-Type Silicon Wafers: Metastable Surface Recombination Centers
Daio, H. ; Buczkowski, A. ; Shimura, F.
Pub. info.: Proceedings of the Symposium on the Degradation of Electronic Devices due to Device Operation as well as Crystalline and Process-Induced Defects.  pp.265-274,  1994.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 1994-1
3.

Conference Proceedings
Conference Proceedings
3. PCA Characterization of Residual Subsurface Damage After Silicon Wafer Mirror Polishing and its Removal
Daio, H. ; Kobayashi, K. ; Ogita, Y.
Pub. info.: Chemical mechanical polishing -- fundamentals and challenges : symposium held April 5-7, 1999, San Francisco, California, U.S.A..  pp.261-266,  2000.  Warrendale, PA.  Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 566