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68 results

Conference Proceedings

1. A novel method of EMC test at the system level of UAV

B. Li ; D. Huang ; R. Nie

Pub. info.:	Sixth International Symposium on Instrumentation and Control Technology: Signal Analysis, Measurement Theory, Photo -Electronic Technology, and Artificial Intelligence : 13-15 October 2006, Beijing, China. pp.635721-1-635721-5, 2006. Bellingham, Wash.. SPIE - The International Society of Optical Engineering
Title of ser.:	Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:	6357

Conference Proceedings

2. The Resistance of SiC/Al Layered Composite to Ballistic Impacting

D. Huang ; W. Zhao

Pub. info.:	Physical and Numerical Simulation of Material Processing VI : Selected, peer reviewed papers from the 6th International Conference on Physical and Numerical Simulation of Materials Processing (ICPNS 2010), November 16-19, 2010, Guilin, China. pp.1011-1016, 2012. Aedermannsdorf, Switzerland. Trans Tech Publications
Title of ser.:	Materials science forum
Ser. no.:	704-705

Conference Proceedings

3. The Influence of SBR on the Recycling Performances of Co₃O₄ Negative Electrode in Lithium-Ion Batteries

W. Yu ; J. Qian ; S. Zhang ; C. Pan ; D. Huang

Pub. info.:	Rechargeable Lithium and Lithium-Ion Batteries. pp.79-85, 2006. Pennington, NJ. Electrochemical Society
Title of ser.:	ECS transactions
Ser. no.:	1(26)

Conference Proceedings

4. Photoluminescence from strained SiGe/Si quantum well structures grown by Si molecular beam epitaxy

Y. Yang ; X.K. Lu ; D. Huang ; X.J. Chen ; Z. Jiang

Pub. info.:	Second International Conference on Thin Film Physics and Applications : '94 TFPA : 15-17 April 1994, Shanghai, China. pp.412-416, 1994. Bellingham, WA. Society of Photo-optical Instrumentation Engineers
Title of ser.:	Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:	2364

Technical Paper

5. Simultaneous Measurements of Droplet Size and Temperature Distribution Within a Water Droplet by using Molecular Tagging Thermometry Technique

H. Hu ; D. Huang

Pub. info.:	AIAA meeting papers on disc. 2008. Reston, Va.. American Institute of Aeronautics and Astronautics
Title of ser.:	AIAA Paper : Aerospace Sciences Meeting and Exhibit
Ser. no.:	2008

Conference Proceedings

6. Implementation of smart photonic bandgap structures using Langmuir-Blodgett films

Y. Zhao ; D. Huang ; R. Shen ; J. Xu

Pub. info.:	Smart structures and materials 1995 : smart materials. pp.80-84, 1995. Bellingham, WA. Society of Photo-optical Instrumentation Engineers
Title of ser.:	Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:	2441

Technical Paper

7. Crack Growth Strategy in Composite Under Static Loading

D. Xie ; Z. Qian ; D. Huang ; F. Abdi

Pub. info.:	AIAA meeting papers on disc. 2006. [Reston, Va.]. American Institute of Aeronautics and Astronautics
Title of ser.:	AIAA Paper : AIAA/ASME/ASCE/AHS/ASC Structures, Structural Dynamics, and Materials Conference
Ser. no.:	2006

Technical Paper

8. Cohesive Zone Model for Surface Cracks Using Finite Element Analysis

D. Xie ; M. Garg ; D. Huang ; F. Abdi

Pub. info.:	AIAA meeting papers on disc. 2008. Reno, Nevada. American Institute of Aeronautics and Astronautics
Title of ser.:	AIAA Paper : AIAA/ASME/ASCE/AHS/ASC Structures, Structural Dynamics, and Materials Conference
Ser. no.:	2008

Conference Proceedings

9. The Physical Origins of Fast and Slow Components in NBTI Degradation for p-MOS Transistors with SiON Gate Dielectric

M. Li ; C. Shen ; T. Yang ; G. Chen ; D. Huang

Pub. info.:	Silicon nitride, silicon dioxide, and emerging dielectrics 9. pp.167-184, 2007. Pennington, N.J.. Electrochemical Society
Title of ser.:	ECS transactions
Ser. no.:	6(3)

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Technical Paper

10. Analytical Characterization and Damage Propagation of Three Dimensional Composites

D. Huang ; F. Abdi

Pub. info.:	AIAA meeting papers on disc. 2006. [Reston, Va.]. American Institute of Aeronautics and Astronautics
Title of ser.:	AIAA Paper : AIAA/ASME/ASCE/AHS/ASC Structures, Structural Dynamics, and Materials Conference
Ser. no.:	2006

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