1.

Conference Proceedings
Conference Proceedings
1. A Novel Concept for Contact Etch Residue Removal
I.J. Vos ; D. Hellin ; S. Demuynck ; O. Richard ; T. Conard
Pub. info.: Cleaning and surface conditioning technology in semiconductor device manufacturing 10.  pp.403-407,  2007.  Pennington, N.J..  Electrochemical Society
Title of ser.: ECS transactions
Ser. no.: 11(2)
2.

Conference Proceedings
Conference Proceedings
2. The Effect of Delay Between Dry Etch and Wet Clean Processing Steps on Cleaning of Post-Etch Residues
D. Hellin ; I.J. Vos ; G. Vereecke ; E. Pavel ; W. Boullart
Pub. info.: Cleaning and surface conditioning technology in semiconductor device manufacturing 10.  pp.283-290,  2007.  Pennington, N.J..  Electrochemical Society
Title of ser.: ECS transactions
Ser. no.: 11(2)
3.

Conference Proceedings
Conference Proceedings
3. How Trace Analytical Techniques Contribute to the Research and Development of Ge and III/V Semiconductor Devices
D. Hellin ; J. Rip ; R. Bonzom ; D. Nelis ; S. Sioncke
Pub. info.: SiGe and Ge, materials, processing, and devices.  pp.173-181,  2006.  Pennington, N.J..  Electrochemical Society
Title of ser.: ECS transactions
Ser. no.: 3(7)