1.

Conference Proceedings
Conference Proceedings
1. Development of automatic OPC treatment and layout decomposition for double dipole lithography for low-k1 imaging
Chiou, T.-B. ; Chen, A. C. ; Hsu, S. D. ; Eurlings, M. ; Hendrickx, E.
Pub. info.: Advanced microlithography technologies : 8-10 November, 2004, Beijing, China.  pp.21-31,  2004.  Bellingham, Wash..  SPIE - The International Society of Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 5645
2.

Conference Proceedings
Conference Proceedings
2. 65-nm full-chip implementation using double dipole lithography
Hsu, S.D. ; Chen, J.F. ; Cororan, N. ; Knose, W.T. ; Broeke, D.J.V.D. ; Laidig, T.L. ; Wampler, K.E. ; Shi, X. ; Hsu, C.M. ; Eurlings, M. ; Finders, J. ; Chiou, T.-B. ; Socha, R.J. ; Conley, W. ; Hsieh, Y.W. ; Tuan, S. ; Hsieh, F.
Pub. info.: Optical Microlithography XVI.  Part One  pp.215-231,  2003.  Bellingham, Wash..  SPIE-The International Society for Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 5040
3.

Conference Proceedings
Conference Proceedings
3. New methods to calibrate simulation parameters for chemically amplified resists
Tollkuehn, B. ; Erdmann, A. ; Kivel, N. ; Robertson, S.A. ; Kang, D. ; Hansen, S.G. ; Fumar-Pici, A. ; Chiou, T.-B. ; Hoppe, W.
Pub. info.: Optical Microlithography XV.  Part Two  pp.1168-1179,  2002.  Bellingham, Wash..  SPIE-The International Society for Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 4691
4.

Conference Proceedings
Conference Proceedings
4. Experimental verification of a model-based decomposition method for double dipole lithography
Eurlings, M. ; Hsu, S.D. ; Hendrickx, E. ; op 't Root, W. ; Laidig, T.L. ; Chiou, T.-B. ; Chen, A. ; Chen, F. ; Vandenberghe, G. ; Finders, J.
Pub. info.: Optical Microlithography XVII.  pp.1225-1236,  2004.  Bellingham, Wash..  SPIE - The International Society of Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 5377
5.

Conference Proceedings
Conference Proceedings
5. Double dipole lithography for 65-nm node and beyond: a technology readiness review
Hsu, S.D. ; Eurlings, M. ; Hendrickx, E. ; Van Den Broeke, D.J. ; Chiou, T.-B. ; Chen, J.F. ; Laidig, T.L. ; Shi, X. ; Finders, J.
Pub. info.: Photomask and Next-Generation Lithography Mask Technology XI.  pp.481-498,  2004.  Bellingham, Wash..  SPIE - The International Society of Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 5446
6.

Conference Proceedings
Conference Proceedings
6. Calibration of ESCAP resist simulation parameters from consideration of printed CD pitch bias, CD measurement offset, and wafer thermal history
Robertson, S.A. ; Kang, D. ; Tye, S.D. ; Hansen, S.G. ; Fumar-Pici, A. ; Chiou, T.-B. ; Byers, J.D. ; Mack, C.A. ; Smith, M.D.
Pub. info.: Advances in Resist Technology and Processing XIX.  Part Two  pp.952-962,  2002.  Bellingham, Wash..  SPIE-The International Society for Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 4690