1.

Conference Proceedings
Conference Proceedings
1. FUTURE DIRECTION FOR MATERIALS IN PRINTED CIRCUIT TECHNOLOGY
Chen, W. T. ; Lafontaine, W. ; Brauer, J. ; Chang, C. S
Pub. info.: Electronic packaging materials science VII : symposium held November 29-December 3, 1993, Boston, Massachusetts, U.S.A..  pp.41-,  1994.  Pittsburgh, Pa..  MRS - Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 323
2.

Conference Proceedings
Conference Proceedings
2. Efficient Interfacial Design-A Multidisciplinary View
Shin, C. F. ; Chen, W. T. ; Cotterell, B. ; Lahiri, S. K. ; Zhang, Y. W.
Pub. info.: Electronic packaging materials science X : symposium held April 14-16, 1998, San Francisco, California, U.S.A..  pp.3-,  1998.  Pittsburgh, Pa..  MRS - Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 515
3.

Conference Proceedings
Conference Proceedings
3. Characteristics and Modeling of Heterojunction Phototransistor with DC Base Bias
Tan, S. W. ; Chen, H. R. ; Chen, W. T. ; Lour, W. S.
Pub. info.: Proceedings of the Fourth International Symposium on Process Physics and Modeling in Semiconductor Technology.  pp.137-143,  2004.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2004-02
4.

Conference Proceedings
Conference Proceedings
4. MOISTURE ABSORPTION AND ITS EFFECTS ON THE PERFORMANCE OF PRINTED CIRCUIT MATERIALS
Liu, P. C. ; Wang, D. W. ; Fuerniss, S. J. ; Poliks, M. D. ; Obrzut, J. ; Siperko, L. M. ; Chen, W. T. ; Havens, R. D. ; Murcko, R. M.
Pub. info.: Electronic packaging materials science VII : symposium held November 29-December 3, 1993, Boston, Massachusetts, U.S.A..  pp.309-,  1994.  Pittsburgh, Pa..  MRS - Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 323
5.

Technical Paper
Technical Paper
5. A fundamental study of the tape automated bonding process
Chen, W. T. ; Raski, J. Z. ; Young, .J. R. ; Jung, D. Y.
Pub. info.: A.S.M.E. paper.  1990.  New York, NY.  The American Society of Mechanical Engineers
Title of ser.: ASME Technical Paper : WA/EEP
Ser. no.: 1990