1.

Conference Proceedings
Conference Proceedings
1. Integrity of Copper-Tantalum Nitride Metallization Under Different Ambient Conditions
Yap, K.P. ; Gong, H. ; Dai, J.Y. ; Osipowicz, T. ; Chan, L.H. ; Lahiri, S.K.
Pub. info.: Low and High Dielectric Constant Materials : Materials Science, Processing, and Reliability Issues, proceedings of the fourth International Symposium and Thin Film Materials for Advanced Packaging Technologies : proceedings of the second International Symposium.  pp.195-208,  1999.  Pennington, N.J..  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 99-7
2.

Conference Proceedings
Conference Proceedings
2. Direct Formation of C54 Phase on the Basis of C40 TiSi2 and Its Applications in Deep Sub-Micron Technology
Chen, S.Y. ; Shen, Z.X. ; Xu, S.Y. ; See, A.K. ; Chan, L.H. ; Li, W.S.
Pub. info.: Gate stack and silicide issues in silicon processing II : symposium held April 17-19, 2001, San Francisco, California, U.S.A..  2002.  Warrendale, PA.  Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 670