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13 results

Conference Proceedings

1. Electromigration Failure Distributions for Multi-Layer Interconnects as a Function of Line Width: Experiments and Simulation

Brown, D. D. ; Sanchez, J. E., Jr. ; Pham, V. ; Besser, P. R. ; Korhonen, M. A. ; Li, C.-Y.

Pub. info.:	Advanced metallization for future ULSI : symposium held April 8-11, 1996, San Francisco, California, U.S.A.. pp.107-, 1996. Pittsburgh, Pa.. MRS - Materials Research Society
Title of ser.:	Materials Research Society symposium proceedings
Ser. no.:	427

Conference Proceedings

2. MECHANICAL PROPERTIES OF PLATED COPPER

Korhonen, M. A. ; Brown, D. D. ; Li, C. -Y. ; Steinwall, J. E.

Pub. info.:	Electronic packaging materials science VII : symposium held November 29-December 3, 1993, Boston, Massachusetts, U.S.A.. pp.103-, 1994. Pittsburgh, Pa.. MRS - Materials Research Society
Title of ser.:	Materials Research Society symposium proceedings
Ser. no.:	323

Conference Proceedings

3. ANALYSIS OF THERMAL STRESS INDUCED VOID GROWTH DURING THERMAL CYCLING

Brown, D. D. ; Korhonen, M. A. ; Borgesen, P. ; Li, C. -Y.

Pub. info.:	Materials reliability in microelectronics III : symposium held April 12-15, 1993, San Francisco, California, U.S.A.. pp.223-, 1993. Pittsburgh, Pa.. MRS - Materials Research Society
Title of ser.:	Materials Research Society symposium proceedings
Ser. no.:	309

Conference Proceedings

4. MICROSTRUCTURE BASED MODELLING OF STRESS MIGRATION AND ELECTROMIGRATION INDUCED FAILURE DISTRIBUTIONS

Borgesen, P. ; Korhonen, M. A. ; Brown, D. D. ; Li. C. -Y.

Pub. info.:	Materials reliability in microelectronics III : symposium held April 12-15, 1993, San Francisco, California, U.S.A.. pp.187-, 1993. Pittsburgh, Pa.. MRS - Materials Research Society
Title of ser.:	Materials Research Society symposium proceedings
Ser. no.:	309

Conference Proceedings

5. EFFECT OF MECHANICAL STRESS ON ELECTROMIGRATION FAILURE MODE DURING ACCELERATED ELECTROMIGRATION TESTS

Pramanick, S. ; Brown, D. D. ; Pham, V, ; Besser, P. ; Sanchez, J. ; Bui, N. ; Hijab, R. ; Yue, J. T.

Pub. info.:	Thin films, stresses and mechanical properties V : symposium held November 28-December 2, 1994, Boston, Massachusetts, U.S.A.. pp.507-, 1995. Pittsburgh, Pa.. MRS - Materials Research Society
Title of ser.:	Materials Research Society symposium proceedings
Ser. no.:	356

Conference Proceedings

6. MICROSTRUCTURE BASED MODELLING OF STRESS MIGRATION AND ELECTROMIGRATION INDUCED FAILURE DISTRIBUTIONS

Borgesen, P. ; Korhonen, M. A. ; Brown, D. D. ; Li, C. -Y.

Pub. info.:	Thin films : stresses and mechanical properties IV : symposium held April 12-16, 1993, San Francisco, California, U.S.A.. pp.255-, 1993. Pittsburgh, Pa.. MRS - Materials Research Society
Title of ser.:	Materials Research Society symposium proceedings
Ser. no.:	308

Conference Proceedings

7. The Effect of Cluster Interactions on Electromigration Induced Stress Evolution in Confined Metal Lines

Brown, D. D. ; Sanchez, J. E., Jr. ; Besser, P. R. ; Korhonen, M. A. ; Li, C.-Y.

Pub. info.:	Materials reliability in microelectronics V : symposium held April 17-21, 1995, San Francisco, California, U.S.A.. pp.197-, 1995. Pittsburgh, Pa.. MRS - Materials Research Society
Title of ser.:	Materials Research Society symposium proceedings
Ser. no.:	391

Conference Proceedings

8. ELECTROMIGRATION DAMAGE BY CURRENT INDUCED COALESCENCE OF THERMAL STRESS VOIDS

Borgesen, P. ; Korhonen, M. A. ; Sullivan, T. D. ; Brown, D. D. ; Li, C. -Y.

Pub. info.:	Thin films : stresses and mechanical properties III : symposium held December 2-5, 1991, Boston, Massachusetts, U.S.A.. pp.683-688, 1992. Pittsburgh, Pa.. Materials Research Society
Title of ser.:	Materials Research Society symposium proceedings
Ser. no.:	239

Conference Proceedings

9. THERMAL STRESS INDUCED VOID FORMATION IN NARROW PASSIVATED Cu LINES

Brown, D. D. ; Borgesen, P. ; Lilienfeld, D. A. ; Korhonen, M. A. ; Li, C. -Y.

Pub. info.:	Thin films : stresses and mechanical properties III : symposium held December 2-5, 1991, Boston, Massachusetts, U.S.A.. pp.701-706, 1992. Pittsburgh, Pa.. Materials Research Society
Title of ser.:	Materials Research Society symposium proceedings
Ser. no.:	239

10.

Conference Proceedings

10. ANALYSIS OF THERMAL STRESS INDUCED VOID GROWTH DURING THERMAL CYCLING

Brown, D. D. ; Korhonen, M. A. ; Borgesen, P. ; Li, C. -Y.

Pub. info.:	Thin films : stresses and mechanical properties IV : symposium held April 12-16, 1993, San Francisco, California, U.S.A.. pp.291-, 1993. Pittsburgh, Pa.. MRS - Materials Research Society
Title of ser.:	Materials Research Society symposium proceedings
Ser. no.:	308

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Author: Brown, D. D.