1.

Conference Proceedings
Conference Proceedings
1. Soft bake effect in 193-nm chemically amplified resist
Sung,M.-G. ; Lee,Y.-M. ; Lee,E.-M. ; Sohn,Y.-S. ; An,I. ; Oh,H.-K.
Pub. info.: Advances in resist technology and processing XVII : 28 February - 1 March 2000, Santa Clara, USA.  Part2  pp.1062-1069,  2000.  Bellingham, Wash..  SPIE - The International Society for Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 3999
2.

Conference Proceedings
Conference Proceedings
2. Photoresist thickness variation due to local and global topography
Kim,J.-Y. ; Bak,H.-J. ; Sohn,Y.-S. ; An,I. ; Bang,K.-Y.M. ; Oh,H.-K. ; Han,W.-S.
Pub. info.: Optical Microlithography XIV.  4346  pp.982-993,  2001.  Bellingham, Wash..  SPIE-The International Society for Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 4346
3.

Conference Proceedings
Conference Proceedings
3. Line-width variation with different sublayers for 0.25-ｦﾌm minimum feature size in DUV lithography
Oh,H.-K. ; Cho,S.-Y. ; Jeong,Y.-U. ; Kang,H.-Y. ; Lee,G.-S. ; An,I. ; Park,I.-H.
Pub. info.: Optical Microlithography X.  pp.215-224,  1997.  Bellingham, Wash..  SPIE-The International Society for Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 3051