1.

Conference Proceedings
Conference Proceedings
1. CHIP SCALE PACKAGING WITH HIGH RELLABILITY FOR MCM APPLICATIONS
Loboda,Mark ; Camilletti,R.C. ; Goodman,L.A. ; White,L. ; Pinch,H.L. ; Shaw,J. ; Patel,V.K. ; Wu,C.P. ; Adema,G.M.
Pub. info.: 1996 International Conference on Multichip Modules : proceedings, April 17-19, 1996, Denver, Colorado.  pp.257-262,  1996.  Reston, Va..  SPIE-The International Society for Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 2794
2.

Conference Proceedings
Conference Proceedings
2. Filp Chip Production Experience:Some Design,Process,Reliability,and Cost Considerations
Rinne,J.D.Mis,G.A. ; Deane,P.A. ; Adema,G.M.
Pub. info.: 1996 International Symposium on Microelectronics : 8-10 October 1996, Minneapolis Convention Center, Minneapolis, Minnesota.  pp.291-295,  1996.  Bellingham, Wash..  SPIE-The International Society for Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 2920