1.

Conference Proceedings
Conference Proceedings
1. InAs on Insulator by Hydrogen Implantation and Exfoliation
S.L. Hayashi ; A. Noori ; R. Sandhu ; A. Cavus ; A. Gutierrez-Aitken
Pub. info.: Semiconductor wafer bonding 9 : science, technology, and applications.  pp.129-136,  2006.  Pennington, N.J..  Electrochemical Society
Title of ser.: ECS transactions
Ser. no.: 3(6)
2.

Conference Proceedings
Conference Proceedings
2. Dry Etching of Sub-Micron Emitter in InP Heterojunction Double Bipolar Transistor Using Inductively Coupled Plasma
P. Nam ; P. C. Chang ; D. Sawdai ; V. Gambin ; D. Scott ; J. Gonzalez ; D. Li ; G. S. Leslie ; X. Zeng ; J. Wang ; D. Matheson ; L. Dang ; R. Elmadjian ; C. Grossman ; M. Barsky ; A. Gutierrez-Aitken ; A. Oki ; S. Olson
Pub. info.: State-of-the-Art Program on Compound Semiconductors (SOTAPOCS XLIII) and Nitride and Wide Bandgap Semiconductors for Sensors, Photonics, and Electronics VI.  pp.88-93,  2006.  Pennington, N.J..  Electrochemical Society
Title of ser.: ECS transactions
Ser. no.: 1(2)
3.

Conference Proceedings
Conference Proceedings
3. 3D Wafer-Scale Integration for RF and Digital Applications
P. Chang-Chien ; A. Gutierrez-Aitken ; R. Sandhu ; K. Hennig ; D. Scott
Pub. info.: Semiconductor Wafer Bonding 10: Science, Technology, and Applications.  pp.243-249,  2008.  Pennington, NJ.  Electrochemical Society
Title of ser.: ECS transactions
Ser. no.: 16(8)