Sensors in electronic packaging : presented at the 1995 ASME International Mechanical Engineering Congress and Exposition, November 12-17, 1995, San Francisco, California
- 責任表示:
- sponsored by the Manufacturing Engineering Division, ASME, the Electrical and Electronic Packaging Division, ASME ; edited by Charles Ume, Chao Pin-Yeh
- シリーズ名:
- ASME Symposia Volumes
- シリーズ巻号:
- EEP 14 ; MED 3
- 出版情報:
- New York, NY: American Society of Mechanical Engineers, 1995
- ISBN:
- 9780791817407 [0791817407]
- 請求記号:
- A11667/3
- 資料種別:
- 国際会議録
類似資料:
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American Society of Mechanical Engineers |
American Society of Mechanical Engineers |
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American Society of Mechanical Engineers |
American Society of Mechanical Engineers |
|
American Society of Mechanical Engineers |
American Society of Mechanical Engineers |
|
American Society of Mechanical Engineers |
American Society of Mechanical Engineers |
|
American Society of Mechanical Engineers |
American Society of Mechanical Engineers |
|
American Society of Mechanical Engineers |
American Society of Mechanical Engineers |
