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Solutions to CFD benchmark problems in electronic packaging : presented at the 29th National Heat Transfer Conference, Atlanta, Georgia, August 8-11, 1993

責任表示:
sponsored by the Heat Transfer Division, ASME ; edited by D. Agonafer
シリーズ名:
ASME Symposia Volumes
シリーズ巻号:
HTD 255
出版情報:
New York, NY: American Society of Mechanical Engineers, 1993
ISBN:
9780791811689 [0791811689]
請求記号:
A11650/931884
資料種別:
国際会議録
巻号一覧
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