Solutions to CFD benchmark problems in electronic packaging : presented at the 29th National Heat Transfer Conference, Atlanta, Georgia, August 8-11, 1993
- 責任表示:
- sponsored by the Heat Transfer Division, ASME ; edited by D. Agonafer
- シリーズ名:
- ASME Symposia Volumes
- シリーズ巻号:
- HTD 255
- 出版情報:
- New York, NY: American Society of Mechanical Engineers, 1993
- ISBN:
- 9780791811689 [0791811689]
- 請求記号:
- A11650/931884
- 資料種別:
- 国際会議録
類似資料:
American Society of Mechanical Engineers |
American Society of Mechanical Engineers |
American Society of Mechanical Engineers |
American Society of Mechanical Engineers |
American Society of Mechanical Engineers |
American Society of Mechanical Engineers |
American Society of Mechanical Engineers |
American Society of Mechanical Engineers |
American Society of Mechanical Engineers |
American Society of Mechanical Engineers |
American Society of Mechanical Engineers |
American Society of Mechanical Engineers |