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Computerized thermophysical property packages : presented at the Winter Annual Meeting of the American Society of Mechanical Engineers, Anaheim, California, November 8-13, 1992

責任表示:
sponsored by the Heat Transfer Division, ASME ; edited by S.G. Penoncello
シリーズ名:
ASME Symposia Volumes
シリーズ巻号:
HTD 225
出版情報:
New York, NY: American Society of Mechanical Engineers, 1992
ISBN:
9780791810705 [0791810704]
請求記号:
A11650/922778
資料種別:
国際会議録
巻号一覧
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