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Electronic and photonic packaging, electrical systems and photonic design, and nanotechnology : presented at the 2003 ASME International Mechanical Engineering Congress : November 15-21, 2003, Washington, D.C.

責任表示:
sponsored by the Electronic and Photonic Packaging Division, ASME ; organized by Ricky Lee ... [et al.]
シリーズ名:
ASME Symposia Volumes
シリーズ巻号:
EPP 3
出版情報:
New York, NY: American Society of Mechanical Engineers, 2003
ISBN:
9780791837146 [0791837149]
請求記号:
A11639/3
資料種別:
国際会議録
巻号一覧
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