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Advances in electronic packaging 2003 : presented at 2003 International Electronic Packaging Technical Conference and Exhibition, July 6-11, 2003, Maui, Hawaii

責任表示:
sponsored by the Electronic and Photonic Packaging Division, ASME
シリーズ名:
ASME Symposia Volumes
シリーズ巻号:
IPACK 2003
出版情報:
New York, NY: American Society of Mechanical Engineers, 2003
ISBN:
9780791836903 [0791836908]
請求記号:
A11638/2003
資料種別:
国際会議録
巻号一覧
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