Packaging of electronic and photonic devices : presented at the 2000 ASME International Mechanical Engineering Congress and Exposition, November, 5-10, 2000, Orlando, Florida
- 責任表示:
- sponsored by the Electrical and Electronic Packaging Division, ASME ; edited by G. J. Kowalski ... [et al.]
- シリーズ名:
- ASME Symposia Volumes
- シリーズ巻号:
- EEP 28
- 出版情報:
- New York, NY: American Society of Mechanical Engineers, 2000
- ISBN:
- 9780791819302 [0791819302]
- 請求記号:
- A11638/28
- 資料種別:
- 国際会議録
類似資料:
|
American Society of Mechanical Engineers |
American Society of Mechanical Engineers |
|
American Society of Mechanical Engineers |
American Society of Mechanical Engineers |
|
American Society of Mechanical Engineers |
American Society of Mechanical Engineers |
|
American Society of Mechanical Engineers |
American Society of Mechanical Engineers |
|
American Society of Mechanical Engineers |
American Society of Mechanical Engineers |
|
American Society of Mechanical Engineers |
American Society of Mechanical Engineers |
