Thermo-mechanical characterization of evolving packaging materials and structures : presented at the 1998 ASME International Mechanical Engineering Congress and Exposition : November 15-20, 1998, Anaheim, California | 東京工業大学附属図書館資料名データベース

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Thermo-mechanical characterization of evolving packaging materials and structures : presented at the 1998 ASME International Mechanical Engineering Congress and Exposition : November 15-20, 1998, Anaheim, California

責任表示:: sponsored by the Electrical and Electronic Packaging Division, ASME ; edited by Sheng Liu, Zhengfang Qian, Chao-pin Yeh
シリーズ名:: ASME Symposia Volumes
シリーズ巻号:: EEP 24
出版情報:: New York, NY: American Society of Mechanical Engineers, 1998
ISBN:: 9780791815915 [0791815919]
請求記号:: A11638/24
資料種別:: 国際会議録

巻号一覧

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詳細

TDL書誌ID:	ZA00063719
シリーズＩＤ:	PA00000270
会議名:	ASME International Mechanical Engineering Congress and Exposition
回次:	1998
会議開催地:	Anaheim, CA, USA
会議開催年:	1998.11.15-1998.11.20

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