Applications of experimental mechanics to electronic packaging 1997 : presented at the 1997 ASME International Mechanical Engineering Congress and Exposition, November 16-21, 1997, Dallas, Texas | 東京工業大学附属図書館資料名データベース

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Applications of experimental mechanics to electronic packaging 1997 : presented at the 1997 ASME International Mechanical Engineering Congress and Exposition, November 16-21, 1997, Dallas, Texas

責任表示:: sponsored by the Electrical and Electronic Packaging Division, ASME, the Applied Mechanics Division, ASME ; edited by J.C. Suhling, K.M. Liechti, S. Liu
シリーズ名:: ASME Symposia Volumes
シリーズ巻号:: AMD 226 ; EEP 22
出版情報:: New York, NY: American Society of Mechanical Engineers, 1997
ISBN:: 9780791818503 [0791818500]
請求記号:: A11638/22
資料種別:: 国際会議録

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詳細

TDL書誌ID:	ZA00063717
シリーズＩＤ:	PA00000270
会議名:	ASME International Mechanical Engineering Congress and Exposition
回次:	1997
会議開催地:	Dallas, TX, USA
会議開催年:	1997.11.16-1997.11.21

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