Applications of experimental mechanics to electronic packaging : presented at the 1995 ASME International Mechanical Engineering Congress and Exposition, November 12-17, 1995, San Francisco, California
- 責任表示:
- sponsored by the Electrical and Electronic Packaging Division, ASME, the Applied Mechanics Division, ASME ; edited by J.C. Suhling
- シリーズ名:
- ASME Symposia Volumes
- シリーズ巻号:
- AMD 214 ; EEP 13
- 出版情報:
- New York, NY: American Society of Mechanical Engineers, 1995
- ISBN:
- 9780791817391 [0791817393]
- 請求記号:
- A11638/13
- 資料種別:
- 国際会議録
類似資料:
|
American Society of Mechanical Engineers |
American Society of Mechanical Engineers |
|
American Society of Mechanical Engineers |
American Society of Mechanical Engineers |
|
American Society of Mechanical Engineers |
American Society of Mechanical Engineers |
|
American Society of Mechanical Engineers |
American Society of Mechanical Engineers |
|
American Society of Mechanical Engineers |
American Society of Mechanical Engineers |
|
American Society of Mechanical Engineers |
American Society of Mechanical Engineers |
