Application of fracture mechanics in electronic packaging and materials : presented at the 1995 ASME International Mechanical Engineering Congress and Exposition, November 12-17, 1995, San Francisco, California
- 責任表示:
- sponsored by the Electrical and Electronic Packaging Division, ASME [and] the Materials Division, ASME ; edited by Tien Y. Wu ... [et al.]
- シリーズ名:
- ASME Symposia Volumes
- シリーズ巻号:
- EEP 11 ; MD 64
- 出版情報:
- New York, NY: American Society of Mechanical Engineers, 1995
- ISBN:
- 9780791817360 [0791817369]
- 請求記号:
- A11638/11
- 資料種別:
- 国際会議録
類似資料:
American Society of Mechanical Engineers |
American Society of Mechanical Engineers |
American Society of Mechanical Engineers |
American Society of Mechanical Engineers |
American Society of Mechanical Engineers |
American Society of Mechanical Engineers |
American Society of Mechanical Engineers |
American Society of Mechanical Engineers |
American Society of Mechanical Engineers |
American Society of Mechanical Engineers |
American Society of Mechanical Engineers |
American Society of Mechanical Engineers |