Advances in electronic packaging 1995 : proceedings of the International Intersociety Electronic Packaging Conference - INTERpack '95 : presented at the International Intersociety Electronic Packaging Conference, March 26-30, 1995, Lahaina, Maui, Hawaii
- 責任表示:
- sponsored by the Electrical and Electronic Packaging Division, ASME, the Japan Society of Mechanical Engineers ; edited by Tai Ran Hsu, Avram Bar-Cohen, Wataru Nakayama
- シリーズ名:
- ASME Symposia Volumes
- シリーズ巻号:
- EEP 10
- 出版情報:
- New York, NY: American Society of Mechanical Engineers, 1995
- ISBN:
- 9780791813034 [0791813037]
- 請求記号:
- A11638/1995
- 資料種別:
- 国際会議録
類似資料:
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American Society of Mechanical Engineers |
American Society of Mechanical Engineers |
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American Society of Mechanical Engineers |
American Society of Mechanical Engineers |
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American Society of Mechanical Engineers |
American Society of Mechanical Engineers |
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American Society of Mechanical Engineers |
American Society of Mechanical Engineers |
|
American Society of Mechanical Engineers | |
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American Society of Mechanical Engineers |
