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Advances in electronic packaging 1995 : proceedings of the International Intersociety Electronic Packaging Conference - INTERpack '95 : presented at the International Intersociety Electronic Packaging Conference, March 26-30, 1995, Lahaina, Maui, Hawaii

責任表示:
sponsored by the Electrical and Electronic Packaging Division, ASME, the Japan Society of Mechanical Engineers ; edited by Tai Ran Hsu, Avram Bar-Cohen, Wataru Nakayama
シリーズ名:
ASME Symposia Volumes
シリーズ巻号:
EEP 10
出版情報:
New York, NY: American Society of Mechanical Engineers, 1995
ISBN:
9780791813034 [0791813037]
請求記号:
A11638/1995
資料種別:
国際会議録
巻号一覧
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