CAE/CAD application to electronic packaging : presented at 1994 International Mechanical Engineering Congress and Exposition, Chicago, Illinois, November 6-11, 1994
- 責任表示:
- CAD application to electronic packaging : presented at 1994 International Mechanical Engineering Congress and Exposition, Chicago, Illinois, November 6-11, 1994
- シリーズ名:
- ASME Symposia Volumes
- シリーズ巻号:
- EEP 9
- 出版情報:
- New York, NY: American Society of Mechanical Engineers, 1994
- ISBN:
- 9780791814604 [0791814602]
- 請求記号:
- A11638/942772
- 資料種別:
- 国際会議録
類似資料:
American Society of Mechanical Engineers |
American Society of Mechanical Engineers |
American Society of Mechanical Engineers |
American Society of Mechanical Engineers |
American Society of Mechanical Engineers |
American Society of Mechanical Engineers |
American Society of Mechanical Engineers |
American Society of Mechanical Engineers |
American Society of Mechanical Engineers |
American Society of Mechanical Engineers |
American Society of Mechanical Engineers |
American Society of Mechanical Engineers |