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CAE/CAD application to electronic packaging : presented at 1994 International Mechanical Engineering Congress and Exposition, Chicago, Illinois, November 6-11, 1994

責任表示:
CAD application to electronic packaging : presented at 1994 International Mechanical Engineering Congress and Exposition, Chicago, Illinois, November 6-11, 1994
シリーズ名:
ASME Symposia Volumes
シリーズ巻号:
EEP 9
出版情報:
New York, NY: American Society of Mechanical Engineers, 1994
ISBN:
9780791814604 [0791814602]
請求記号:
A11638/942772
資料種別:
国際会議録
巻号一覧
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