Electronic packaging reliability : presented at the 1993 ASME Winter Annual Meeting, New Orleans, Louisiana, November 28-December 3, 1993 | 東京工業大学附属図書館資料名データベース

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Electronic packaging reliability : presented at the 1993 ASME Winter Annual Meeting, New Orleans, Louisiana, November 28-December 3, 1993

責任表示:: sponsored by the Electrical and Electronic Packaging Division, ASME ; edited by L. T. Nguyen, M.G. Pecht
シリーズ名:: ASME Symposia Volumes
シリーズ巻号:: EEP 6
出版情報:: New York, NY: American Society of Mechanical Engineers, 1993
ISBN:: 9780791810354 [0791810356]
請求記号:: A11638/940254
資料種別:: 国際会議録

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詳細

TDL書誌ID:	ZA00063704
シリーズＩＤ:	PA00000270
会議名:	ASME Winter Annual Meeting
回次:	1993
会議開催地:	New Orleans, LA, USA
会議開催年:	1993.11.28-1993.12.03

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