Thermal management, solder technology, optoelectronics packaging : Advances in electronic packaging, 1993 : proceedings of the 1993 ASME International Electronics Packaging Conference : presented at the ASME International Electronics Packaging Conference, Binghamton, New York, September 29-October 2, 1993 | 東京工業大学附属図書館資料名データベース

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Thermal management, solder technology, optoelectronics packaging : Advances in electronic packaging, 1993 : proceedings of the 1993 ASME International Electronics Packaging Conference : presented at the ASME International Electronics Packaging Conference, Binghamton, New York, September 29-October 2, 1993

責任表示:: sponsored by the American Society of Mechanical Engineers ; edited by P.A. Engel, W.T. Chen
シリーズ名:: ASME Symposia Volumes
シリーズ巻号:: EEP 4-2
出版情報:: New York, NY: American Society of Mechanical Engineers, 1993
ISBN:: 9780791806869 [0791806863]
請求記号:: A11638/1993
資料種別:: 国際会議録

巻号一覧

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詳細

TDL書誌ID:	ZA00063703
シリーズＩＤ:	PA00000270
会議名:	ASME International Electronics Packaging Conference
回次:	1993
会議開催地:	Binghamton, NY, USA
会議開催年:	1993.09.29-1993.10.02

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