Structural analysis, materials and processes, design, reliability : Advances in electronic packaging, 1993 : proceedings of the 1993 ASME International Electronics Packaging Conference : presented at the ASME International Electronics Packaging Conference, Binghamton, New York, September 29-October 2, 1993
- 責任表示:
- sponsored by the American Society of Mechanical Engineers ; edited by P.A. Engel, W.T. Chen
- シリーズ名:
- ASME Symposia Volumes
- シリーズ巻号:
- EEP 4-1
- 出版情報:
- New York, NY: American Society of Mechanical Engineers, 1993
- ISBN:
- 9780791806869 [0791806863]
- 請求記号:
- A11638/1993
- 資料種別:
- 国際会議録
類似資料:
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American Society of Mechanical Engineers |
American Society of Mechanical Engineers |
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American Society of Mechanical Engineers |
American Society of Mechanical Engineers |
|
American Society of Mechanical Engineers | |
|
American Society of Mechanical Engineers |
American Society of Mechanical Engineers |
|
American Society of Mechanical Engineers |
American Society of Mechanical Engineers |
|
American Society of Mechanical Engineers |
American Society of Mechanical Engineers |
