Manufacturing aspects in electronic packaging : presented at the Winter Annual Meeting of the American Society of Mechanical Engineers, Anaheim, California, November 8-13, 1992
- 責任表示:
- sponsored by the Electrical and Electronic Packaging Division and the Production Engineering Division, ASME ; edited by Y.C. Lee, T.J. Bennett
- シリーズ名:
- ASME Symposia Volumes
- シリーズ巻号:
- EEP 2 ; PED 60
- 出版情報:
- New York, NY: American Society of Mechanical Engineers, 1992
- ISBN:
- 9780791811122 [0791811123]
- 請求記号:
- A11638/922659
- 資料種別:
- 国際会議録
類似資料:
American Society of Mechanical Engineers |
American Society of Mechanical Engineers |
American Society of Mechanical Engineers |
American Society of Mechanical Engineers |
American Society of Mechanical Engineers |
American Society of Mechanical Engineers |
American Society of Mechanical Engineers |
American Society of Mechanical Engineers |
American Society of Mechanical Engineers |
American Society of Mechanical Engineers |
American Society of Mechanical Engineers |
American Society of Mechanical Engineers |