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Manufacturing aspects in electronic packaging : presented at the Winter Annual Meeting of the American Society of Mechanical Engineers, Anaheim, California, November 8-13, 1992

責任表示:
sponsored by the Electrical and Electronic Packaging Division and the Production Engineering Division, ASME ; edited by Y.C. Lee, T.J. Bennett
シリーズ名:
ASME Symposia Volumes
シリーズ巻号:
EEP 2 ; PED 60
出版情報:
New York, NY: American Society of Mechanical Engineers, 1992
ISBN:
9780791811122 [0791811123]
請求記号:
A11638/922659
資料種別:
国際会議録
巻号一覧
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